Samsung is expected to unleash the new Galaxy S7 in early 2016. While there is no official word about its specs, appearance or launch schedule, there is now a wealth of information available that can give the public a clear picture about the device before it finally hits the stores.
The latest leaked information pertains to a purported internal heat pipe. The S7 could possibly sport one under its hood to avoid SoC overheating issues. Samsung is currently said to be testing different heat pipe technologies and that a decision whether to integrate the heat solution or not will be made by the end of the year, according to Phone Arena. If Samsung decides to pursue this solution, it will not be the first to do so. The Sony has deployed one in Xperia Z5 Premium, and so did the Xiaomi and OnePlus with the Note Pro and OnePlus 2 devices.
Reports about the S7's design are still inconclusive. There is information, for instance, that the S7 will have an all-metal construction, as HNGN previously reported. But the latest news in this area points to a minimal design change, which could disappoint some fans.
"As the S6 and S6 Edge represented progress, the S7 will have improvements both in picture quality, performance and other some new features," one source said by telephone, The Korea Times reported. "But because smartphones have already been commoditized, you don't need to spend more on a surface overhaul."
The information from The Korea Times has been confirmed by other sources, including reports by the International Business Times and BGR.
